Horizontal In-Line System


  • SuVAS™ H-Series는 Back Electrode, CIG Precursor 그리고 TCO (Transparent Conductive Oxide)
    박막을 증착하는 설비이며, Several Glass Loading Technology와 Cylindrical Cathode로 작동되며
    높은 생산성 및 향상된 타겟 사용률을 제공함


  • Horizontal in-line type system
    Minimizing particles inside the chamber
    Simplified distributing using non-carrier transfer system
    Maximizing the efficiency of target usage and improving quality of thin-film by target rotation and moving the magnet on the cathode part
    Several sheets of glass loading technology and cylindrical cathodes
    High throughput and extended target utilization rate.


  • Applicable Substrate Size

    Max Gen 8th Substrate

    Tact Time

    Within 60sec

    Target Materials

    Ag, Al, Al2O3, AlNd, AZO, CIGS, Cr, Cu, CuGa, CuIn, GZO, IGZO, In, ITO, IZO, Mo, MoTi, MoW, Ni, Se, SiO2, TiO2, ZnO

    Power Source

    DC, Pulsed DC or MF

    Thickness Uniformity

    Within ±5%

    Sheet Resistance Uniformity

    Within ±12%

    Heating Temp

    Max 250℃ (Based on substrate temp.)

    Heating Temp. Uniformity

    Within ±15℃